Zestron Webinar: Designing for Reliability in Class III Assemblies

FREE Webinar

October 26, 11 AM EST

Webinar Abstract:

When designing high-reliability electronic assemblies, functionality is critical and long-term reliability is essential.  Join our webinar for a detailed overview of the various failure mechanisms including the challenges associated with improper cleaning, board complexity, material mix, component, and the package types used. Thru an in-depth case study examination, we will discuss the steps involved in reducing the risk of failures while improving long-term reliability.

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